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• MSFC: not test port....QA documents probably show it was OK

• L Temp tests: just starting (briefing may not take resiliency into account)

3 scenarios:

(1) ICE (H2O in device joints)...was there in STS-9 destacking... that reduces squeeze ~5 mil (tests on-going)
(2) seal resiliency
(3) damaged sec. seal. Closeout photos.

All bulk/case/insulation problems would have been seen in Pc

• crack in MLP 2 (they're shimmed different)

• AA winds report - being discounted