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• MSFC: not test port....QA documents probably show it was OK • L Temp tests: just starting (briefing may not take resiliency into account) 3 scenarios: (1) ICE (H2O in device joints)...was there in STS-9 destacking... that reduces squeeze ~5 mil (tests on-going) (2) seal resiliency (3) damaged sec. seal. Closeout photos. All bulk/case/insulation problems would have been seen in Pc • crack in MLP 2 (they're shimmed different) • AA winds report - being discounted